
ESWIN
Develops integrated chips and solutions focused on displays and videos, AI data processing, and wireless connection.
Date | Investors | Amount | Round |
---|---|---|---|
investor investor investor investor | €0.0 | round | |
investor investor investor investor investor investor | €0.0 | round | |
* | CNY4.0b | Series C | |
Total Funding | 000k |
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ESWIN Group is a leading semiconductor company headquartered in Beijing, with R&D centers and manufacturing bases across China, the UK, South Korea, and the US. The company specializes in providing integrated circuit (IC) solutions and advanced packaging for various applications, including mobile devices, smart homes, smart transportation, and industrial IoT (Internet of Things). ESWIN's business model revolves around leveraging its top-class technology and management team to innovate and deliver globally competitive products and services. The company serves a diverse range of clients, from consumer electronics manufacturers to industrial automation firms, aiming to help them succeed in the rapidly evolving AIoT (Artificial Intelligence of Things) era. ESWIN generates revenue through the sale of its semiconductor products and solutions, as well as through strategic partnerships and collaborations within the industry. The company's customer-centric approach and commitment to technological innovation position it as a key player in the global semiconductor market.
Keywords: semiconductor, IC solutions, smart homes, industrial IoT, mobile devices, advanced packaging, AIoT, R&D, global presence, innovation.